文件名称：Reliability Study on High Density LED Packaging with Chip On Board Structures
文件大小：1.29MB
文件格式：PDF
更新时间：2013-09-12 04:41:36
LED
LED芯片阵列封装的可靠性研究，希望对你们有帮助。
Reliability Study on High Density LED Packaging with Chip On Board Structures
【文件属性】：
文件名称：Reliability Study on High Density LED Packaging with Chip On Board Structures
文件大小：1.29MB
文件格式：PDF
更新时间：2013-09-12 04:41:36
LED
LED芯片阵列封装的可靠性研究，希望对你们有帮助。